Electroplating Posted by کاردان خانه آبکار 18 اسفند 1393 Electroplating Table of ContentsPreface ix1 Metal Finishing – A KeyTechnology?1.] Introduction1.2 Coating Technologies 1.2.1 Vacuum Evaporation1.2.2 Weld-Surfacing: Molten Metal Coating Processes1.2.3 Organic Coating, Painting1.2.4 Thermal Spraying1.2.5 Metallising1.3 Electroplating Processes1.3.1 Rack Plating1.3.2 Mass Plating1.3.3 Continuous Plating1.3.4 In-line Plating Processes1.4 Electroplating and its Key Role1.4.1 Metallic Coatings1.4.2 Areas of Application1.5 Requirements for Metal Finishing1. 5.1 Quality and Cost Effectiveness1.5.2 Ecology and the EnvironmentReferences2 Materials that can be Electroplated2.1 Introduction2.2 Metals2.2.1 Zero-Dimensional Lattice Defects2.2.2 One-Dimensional Lattice Defects2.2.3 Two-Dimensional Lattice Defects2.3 Alloys2.3.1 Interstitial Solid Solutions2.3.2 Substitutional Solid Solutionsvi TaMe of COlltl’l1tS2.4 Plastics 382.4.1 Amorphous Polymers 392.4.2 Partly Crystalline Polymers 402.4.3 Intrinsically Conductive Polymers 43References 5]3 Electrolytes for the Deposition of Metal Coatings 553.1 Introduction 563.2 Electrodeposition Electrolytes 583.2.1 Electroplating Electrolytes 583.2.2 Electroless Deposition Electrolytes 76References 844 Processes for the Deposition of Metallic Coatings 874.1 Introduction 884.2 Electroless Metal Deposition 894.2.1 Deposition of Metal Layers 894.2.2 Deposition of Alloys 904.2.3 Deposition of Composite Coatings 924.2.4 Coating Thickness Distribution 934.3 Electrolytic Metal Deposition 944.3.1 Direct Current Electrodeposition 964.3.2 Pulse Plating Processes 1174.3.3 Laser-induced Metal Deposition 131References 1375 Electrodeposition Considered at the Atomistic Level 1415.1 Introduction 142– ~7.- Structure of Metal Ions 1435.3 Structure of the Electrical Double Layer 1455.3.1 Helmholtz-Perrin Model 1455.3.2 Gouy-Chapman Model 1465.3.3 Stern-Graham Model 1485.4 Rate-Determining Steps in Electrode Reactions ] 505.4.1 Concentration Overvoltage ] 515.4.2 Charge-Transfer Overpotential 1525.4.3 Crystallisation Overvoltage 1525.4.4 Resistance Overvoltage 1535.5 Electrocrysta Ilisation ] 535.5.1 Nucleation ] 535.5.2 Growth of Nuclei 1615.6 Whisker Growth 172References 1756 IIIsitu Observation of EIectrodeposition 1796.1 Introduction 1806.2 Scanning Probe Microscope (SPM) 180Tali/e of Contellts vii6.2.] Scanning Tunnelling Microscopy (STM) 1826.2.2 Scanning force Microscopy (SFM) 202References 2137 Adhesion and its Measurement 2] 77.1 Introduction 2187.2 Metal-Metal Adhesion 2197.2.] Diffusion Theory 2197.3 Polymer-Metal Adhesion 2247.3.1 ‘Press-stud’Theory 2257.3.2 Wetting Theory 2287.3.3 Electrostatic Theory 2297.4 Methods for the Determination of Adhesion 2307.4.1 Qualitative Test Methods 2307.4.2 Quantitative Adhesion Tests 2357.4.3 Non-Destructive Test Methods 240References 2448 Coating Thickness and its Measurement 2478.1 Introduction 2488.2 Destructive Processes 2488.2.1 Microscopic Methods 2498.2.2 Coulometric Methods 2658.3 Non-Destructive Methods 2698.3.1 Eddy Current Method 2698.3.2 X-ray Fluorescence Techniques 2748.4 III situ Measurement Methods 28]8.4.1 Island Method 2818.4.2 Optipulse method 284References 2899 Analytical Study of Metallic Layers 2939.1 Introduction 2949.2 Mass Spectrometric Methods 3019.2.1 Ion Scattering Spectrometry (ISS) 3029.2.2 Secondary Ion Mass Spectrometry (SIMS) 3059.2.3 Secondary Neutral Particle Mass Spectrometry (SNMS) 3109.3 Electron Spectroscopic Methods 3149.3.1 Auger Electron Spectroscopy (AES) 3159.3.2 Electron Spectroscopy for Chemical Analysis (ESCA) 3219.4 Microanalysis 3269.4.] Energy-Dispersive X-Ray Analysis (EDX) 3309.4.2 Wavelength DispersiveX-RayAnalysis (WDX) 337References 342Index 347 کاردان خانه آبکار 18 اسفند 1393 نوشته قبلی THE PARTHIAN BATTERY نوشته بعدی Gold Plating Tecnology
نظرتان را بیان کنید