Electroplating

Table of Contents
Preface           ix
1 Metal Finishing – A KeyTechnology?
1.] Introduction
1.2 Coating Technologies

1.2.1 Vacuum Evaporation
1.2.2 Weld-Surfacing: Molten Metal Coating Processes
1.2.3 Organic Coating, Painting
1.2.4 Thermal Spraying
1.2.5 Metallising
1.3 Electroplating Processes
1.3.1 Rack Plating
1.3.2 Mass Plating
1.3.3 Continuous Plating
1.3.4 In-line Plating Processes
1.4 Electroplating and its Key Role
1.4.1 Metallic Coatings
1.4.2 Areas of Application
1.5 Requirements for Metal Finishing
1. 5.1 Quality and Cost Effectiveness
1.5.2 Ecology and the Environment
References
2 Materials that can be Electroplated
2.1 Introduction
2.2 Metals
2.2.1 Zero-Dimensional Lattice Defects
2.2.2 One-Dimensional Lattice Defects
2.2.3 Two-Dimensional Lattice Defects
2.3 Alloys
2.3.1 Interstitial Solid Solutions
2.3.2 Substitutional Solid Solutions
vi TaMe of COlltl’l1tS
2.4 Plastics 38
2.4.1 Amorphous Polymers 39
2.4.2 Partly Crystalline Polymers 40
2.4.3 Intrinsically Conductive Polymers 43
References 5]
3 Electrolytes for the Deposition of Metal Coatings 55
3.1 Introduction 56
3.2 Electrodeposition Electrolytes 58
3.2.1 Electroplating Electrolytes 58
3.2.2 Electroless Deposition Electrolytes 76
References 84
4 Processes for the Deposition of Metallic Coatings 87
4.1 Introduction 88
4.2 Electroless Metal Deposition 89
4.2.1 Deposition of Metal Layers 89
4.2.2 Deposition of Alloys 90
4.2.3 Deposition of Composite Coatings 92
4.2.4 Coating Thickness Distribution 93
4.3 Electrolytic Metal Deposition 94
4.3.1 Direct Current Electrodeposition 96
4.3.2 Pulse Plating Processes 117
4.3.3 Laser-induced Metal Deposition 131
References 137
5 Electrodeposition Considered at the Atomistic Level 141
5.1 Introduction 142
– ~7.- Structure of Metal Ions 143
5.3 Structure of the Electrical Double Layer 145
5.3.1 Helmholtz-Perrin Model 145
5.3.2 Gouy-Chapman Model 146
5.3.3 Stern-Graham Model 148
5.4 Rate-Determining Steps in Electrode Reactions ] 50
5.4.1 Concentration Overvoltage ] 51
5.4.2 Charge-Transfer Overpotential 152
5.4.3 Crystallisation Overvoltage 152
5.4.4 Resistance Overvoltage 153
5.5 Electrocrysta Ilisation ] 53
5.5.1 Nucleation ] 53
5.5.2 Growth of Nuclei 161
5.6 Whisker Growth 172
References 175
6 IIIsitu Observation of EIectrodeposition 179
6.1 Introduction 180
6.2 Scanning Probe Microscope (SPM) 180
Tali/e of Contellts vii
6.2.] Scanning Tunnelling Microscopy (STM) 182
6.2.2 Scanning force Microscopy (SFM) 202
References 213
7 Adhesion and its Measurement 2] 7
7.1 Introduction 218
7.2 Metal-Metal Adhesion 219
7.2.] Diffusion Theory 219
7.3 Polymer-Metal Adhesion 224
7.3.1 ‘Press-stud’Theory 225
7.3.2 Wetting Theory 228
7.3.3 Electrostatic Theory 229
7.4 Methods for the Determination of Adhesion 230
7.4.1 Qualitative Test Methods 230
7.4.2 Quantitative Adhesion Tests 235
7.4.3 Non-Destructive Test Methods 240
References 244
8 Coating Thickness and its Measurement 247
8.1 Introduction 248
8.2 Destructive Processes 248
8.2.1 Microscopic Methods 249
8.2.2 Coulometric Methods 265
8.3 Non-Destructive Methods 269
8.3.1 Eddy Current Method 269
8.3.2 X-ray Fluorescence Techniques 274
8.4 III situ Measurement Methods 28]
8.4.1 Island Method 281
8.4.2 Optipulse method 284
References 289
9 Analytical Study of Metallic Layers 293
9.1 Introduction 294
9.2 Mass Spectrometric Methods 301
9.2.1 Ion Scattering Spectrometry (ISS) 302
9.2.2 Secondary Ion Mass Spectrometry (SIMS) 305
9.2.3 Secondary Neutral Particle Mass Spectrometry (SNMS) 310
9.3 Electron Spectroscopic Methods 314
9.3.1 Auger Electron Spectroscopy (AES) 315
9.3.2 Electron Spectroscopy for Chemical Analysis (ESCA) 321
9.4 Microanalysis 326
9.4.] Energy-Dispersive X-Ray Analysis (EDX) 330
9.4.2 Wavelength DispersiveX-RayAnalysis (WDX) 337
References 342
Index 347